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In order to face new market demands, the new technologies need to integrate more and more functionalities while being smaller. Thus, thermal dissipation is now a major issue to solve for industrials. 

Our HTP-10 adhesive thermal interfaces from our range Gergotim allow to dissipate the excess heat generated within the housing. Thanks to them, the electronic components are preserved from failure and can now offer an optimal long-term performance. 

Thanks to a unique and highly innovative construction, our thermal conductive adhesive tapes offer excellent thermal dissipation combined to excellent electrical insulation. 

Our thermal interfaces are available in 4 standard thicknesses (180µm, 250µm, 500µm and 1000µm). In that way, you can keep the control of the final mounted component thickness. 

Unlike other solutions available on the market, our HTP-10 solutions are double-sided, allowing a better adhesion on the surface (no air entrapment) and an easier and faster assembly process (to reduce your costs). 

Benefit from the many other advantages of our thermal conductive tapes by contacting us. Our sales team is at your disposal to answer your questions, study your projects or send you some samples.