HIGH PERFORMANCE THERMAL INTERFACE
Over the last few years, the electronics sector (all markets combined) didn't stop growing and facing new problematics. Nowadays, numerous electronic components have been miniaturised, however housings/devices need to fill more and more functionalities. Thus, thermal management is a major issue for electronic companies.
In this context, we developed a large range of adhesive thermal interfaces, including our HTP-10 standard product which allows to dissipate the excess heat generated and therefore to ensure long product life cycle and an optimal long-term performance.
HTP-10's major advantages:
- Different applications (thermal management, heat-sink thermal interfaces, LED lighting thermal management)
- 4 standard thicknesses (180 µm, 250 µm, 500 µm and1000 µm)
- Excellent thermal dissipation combined to excellent electrical insulation
- Silicone free
- Possibility to die-cut to the desired form and dimensions
Don't hesitate to contact us if you need to know more.
