For many markets (automotive, household appliances, electrical equipment, consumer electronics, etc.), the miniaturization of electronic components and their use continues to grow. As a result, these components find themselves in confined spaces, where the heat generated by electronic systems increases, potentially leading to component deterioration.
This trend generates a need for thermal dissipation, and the use of thermal interface materials (TIMs) is essential.
Thanks to their breakthrough technology, our silicone thermal pads provide significant benefits such as a low carbon footprint and a high-volume manufacturing process.
Adhesive on both sides, our thermal pads are highly conformable and compressible, and can withstand high temperatures (up to 200°C). They are manufactured without silicone oil, which means no leakage and little outgassing. Our TSI pads are available with different levels of hardness and thermal conductivity.
The advantages of our thermal pads over liquid fillers:
Our adhesive thermal interface solutions, part of the GERGOTIM range, have a unique and innovative construction and guarantee very good thermal conductivity and electrical insulation.
Our adhesives guarantee excellent thermal management and ensure reliable heat transfer between heat-generating electronic components and cooling devices such as fans or heat sinks (radiators).
GERGOTIM thermal interface adhesive tapes are manufactured in rolls and can be cut to fit each application.
Their double-sided adhesive properties allow :
